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USB in Automotive SoCs – Ensuring Reliability, Functional Safety, and Quality

June 30, 2021 - Simplified Chinese: Join this webinar to learn about new and emerging automotive applications using USB 3.2 and USB 3.1 interfaces.

PCI Express 6.0 Design Considerations and IP Implementation

June 24, 2021 - In this webinar, you will learn about key features of PCIe 6.0 including FLITs, power state and PAM-4 signaling as well as design considerations and IP implementation for a successful migration to ...

Building AI-enabled Computational Storage Systems with Application Processor IP

June 17, 2021 - Simplified Chinese: This presentation will describe the cloud and AI trends driving the growth of computational storage.

Building AI-enabled Computational Storage Systems with Application Processor IP

June 17, 2021 - Traditional Chinese: This presentation will describe the cloud and AI trends driving the growth of computational storage.

PCIe® Technology for Automotive Functional Safety

June 16, 2021 - Synopsys and Intel present on how PCIe technology enables safety-critical applications, including ASIL targets for automotive applications.

SemiEngineering: Getting Ready For An Efficient Shift To PCI Express 6.0 ...

June 10, 2021 - This article provides designers a summary of the major changes and how they can be handled to ensure a smooth and successful transition to PCIe 6.0.

SemiEngineering: There's More To Machine Learning Than CNNs

June 09, 2021 - Different learning structures provide optimizations based on variables such as time, accuracy, and what’s considered important in the data.

SemiEngineering: The Good And Bad Of Auto IC Updates

June 08, 2021 - Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a ...

MIPI for Camera/Imaging and Display: A Technical Overview

June 07, 2021 - Get an overview of MIPI applications & specifications and an in-depth look at MIPI from the system level to physical layer & testing.

How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity

In this blog post, we’ll discuss how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can ...