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SemiEngineering: Die-to-Die Connectivity With High-Speed SerDes PHY IP

March 12, 2020 - Multi-chip module packaging for HPC, Ethernet, and AI SoCs demands low latency, high throughput PHYs.

SemiEngineering: How AI in Edge Computing Drives 5G and the IoT

February 13, 2020 - Understanding what edge computing really is and how it fits in pervasive computing.

SemiEngineering: Non-Volatile Memory Tradeoffs Intensify

January 22, 2020 - Why NVM is becoming so application-specific and what the different options are.

SemiEngineering: Analog: Avoid Or Embrace?

January 16, 2020 - Data converters are required whenever you move between the analog and digital domains, and they present both challenges and opportunities.