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Ensuring Known Good Dies in SiPs with Die-to-Die PHY IP

January 28, 2021 - Learn how high-performance computing (HPC) SoC designers leverage the SerDes-based USR/XSR or parallel-based HBI die-to-die PHY IP solution.

DesignWare Technical Bulletin: Using IP Interfaces to Reduce HPC Latency and ...

January 20, 2021 - Learn about the latest high-speed interface IP standards that help minimize the latency of your high-performance SoCs in cloud systems.

Using IP to Make the Best Design Selections for HDMI and DisplayPort SoCs

January 19, 2021 - Simplified Chinese: In this webinar, we outline various common and new use cases for display standards including HDMI, DisplayPort (DP), embedded DisplayPort (eDP), and VESA DSC.

Using IP to Make the Best Design Selections for HDMI and DisplayPort SoCs

January 19, 2021 - Traditional Chinese: In this webinar, we outline various common and new use cases for display standards including HDMI, DisplayPort (DP), embedded DisplayPort (eDP), and VESA DSC.

SemiEngineering: Designs Beyond The Reticle Limit

November 12, 2020 - Chips are hitting technical and economic obstacles, but that is barely slowing the rate of advancement in design size and complexity

The New Frontier of Die-to-Die Interface IP

October 28, 2020 - Simplified Chinese: This Synopsys webinar summarizes the market trends and die-to-die use cases for high-performance computing (HPC) SoC designs.

The New Frontier of Die-to-Die Interface IP

October 28, 2020 - Traditional Chinese: This Synopsys webinar summarizes the market trends and die-to-die use cases for high-performance computing (HPC) SoC designs.

DesignWare Technical Bulletin: From XSR to Long-Reach: Avoid Cloud Data ...

October 16, 2020 - Choose the right IP for your HPC SoC designed for XSR, USR, or long-reach cloud computing applications

SemiWiki: Parallel-Based PHY IP for Die-to-Die Connectivity

September 17, 2020 - Learn more about the motivation for multi-chip integration.

DesignWare Technical Bulletin: Production Test of System-in-Package with ...

July 21, 2020 - This article describes how efficient production test of system-in-packages (SiPs) using die-to-die PHY IP can ensure the end-product is not defective and the production yield is kept as high as ...