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The New Frontier of Die-to-Die Interface IP

October 28, 2020 - Simplified Chinese: This Synopsys webinar summarizes the market trends and die-to-die use cases for high-performance computing (HPC) SoC designs.

The New Frontier of Die-to-Die Interface IP

October 28, 2020 - Traditional Chinese: This Synopsys webinar summarizes the market trends and die-to-die use cases for high-performance computing (HPC) SoC designs.

DesignWare Technical Bulletin: From XSR to Long-Reach: Avoid Cloud Data ...

October 16, 2020 - Choose the right IP for your HPC SoC designed for XSR, USR, or long-reach cloud computing applications

SemiWiki: Parallel-Based PHY IP for Die-to-Die Connectivity

September 17, 2020 - Learn more about the motivation for multi-chip integration.

DesignWare Technical Bulletin: Production Test of System-in-Package with ...

July 21, 2020 - This article describes how efficient production test of system-in-packages (SiPs) using die-to-die PHY IP can ensure the end-product is not defective and the production yield is kept as high as ...

The New Frontier of Die-to-Die Interface IP: What You Need to Know for ...

June 16, 2020 - In this webinar our SVP, John Koeter, summarizes the market trends and die-to-die use cases for high-performance computing (HPC) SoC designs.

Product Update: Advances in DesignWare Die-to-Die PHY IP

June 08, 2020 - Hear the latest about Synopsys' DesignWare MIPI Die-to-Die PHY IP for SerDes-based 112G USR/XSR and parallel-based HBI interfaces. The IP, available in advanced FinFET processes, addresses the ...

SemiEngineering: High-Speed SerDes At 7/5nm

June 02, 2020 - Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA ...

Leveraging IP to Enable Reliable Die-to-Die Connectivity

April 22, 2020 - This webinar describes the different use cases for die-to-die connectivity and illustrates how to choose the best PHY to fit the needs of multi-chip modules (MCMs).

SemiEngineering: Die-To-Die Connectivity

April 22, 2020 - Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as ...