July 21, 2021 - Tradeoffs grow as chipmakers leverage a variety of architectural choices.
July 14, 2021 - Learn about the Ethernet PHY used in HPC SoCs and how an integrated MAC+ PHY IP accelerates path to compliance and time-to-design
July 14, 2021 - Learn about the standards-compliant hardware secure module IP for automotive that enable SoC designers to implement the required security with low risk and fast time to market.
July 14, 2021 - Learn about scalable, reliable OTP NVM IP for CMOS image sensors that offers small silicon footprint, and its built-in security features protect against attacks, tampering, hacking, and reverse ...
July 14, 2021 - Learn about the complete Die-to-Die IP solution, uses cases, requirements and how to address the challenges of multi-die SoCs
July 14, 2021 - Learn how data center power and performance can be optimized using computational storage with processor IP
July 08, 2021 - Getting the right mix of analog and digital blocks for best performance, lowest power, and smallest area.
June 25, 2021 - If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology ...
June 10, 2021 - This article provides designers a summary of the major changes and how they can be handled to ensure a smooth and successful transition to PCIe 6.0.
June 09, 2021 - Different learning structures provide optimizations based on variables such as time, accuracy, and what’s considered important in the data.